39-ICH08_ASEC胶水 衡鹏供应ASEC 39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.
39-ICH08_ASEC胶水特长：Liquid stateProperty    Typical Value   Test ConditionChemical    Epoxy (Black) Specific Gravity 1.4                @25度Thixotropic index 1.0             12s-1/120s-1Viscosity    4.200 mPa·s        Cone plate type, 120s-1
Cured stateProperty      Typical Value   Test ConditionTensile Modulus         4.6 Gpa               25度, DMATg                 120度                 DMSCTE α1/α2         39/105  ppm/度         TMATensile shear strength 16 Mpa               JIS K 6850Volume resistivity 2.28 x 1015Ω·cm     JIS K 6911Surface resistivity 9.7 x 1015Ω       JIS K 6911Dielectric constant 3.08               1.0GHz                 3.05               2.45GHzDielectric loss tangent 0.015               1.0GHz                 0.015               2.45GHz

39-ICH08_ASEC胶水相关产品：衡鹏供应ASEC胶水39-ICH09