爱赛克底部填充胶39-ICH08_UNDERFILL

 

爱赛克底部填充胶39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.

 

 

 

39-ICH08_爱赛克底部填充胶特长：

Liquid state

Property   Typical Value  Test Condition

Chemical   Epoxy (Black)

Specific Gravity 1.4               @25度

Thixotropic index 1.0            12s-1/120s-1

Viscosity   4.200 mPa·s       Cone plate type, 120s-1

 

Cured state

Property     Typical Value  Test Condition

Tensile Modulus        4.6 Gpa              25度, DMA

Tg                120度                DMS

CTE α1/α2        39/105  ppm/度        TMA

Tensile shear strength 16 Mpa              JIS K 6850

Volume resistivity 2.28 x 1015Ω·cm     JIS K 6911

Surface resistivity 9.7 x 1015Ω      JIS K 6911

Dielectric constant 3.08              1.0GHz

               3.05              2.45GHz

Dielectric loss tangent 0.015              1.0GHz

               0.015              2.45GHz

 

 

爱赛克UNDERFILL底部填充胶39-ICH08相关产品：

衡鹏供应

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